MEMBER FOR MOUNTING SEMICONDUCTOR ELEMENT, PROCESS FOR PRODUCING SAME, AND SEMICONDUCTOR DEVICE

摘要

Disclosed is a member for mounting a semiconductor element thereon, the member being obtained by infiltrating a matrix metal into a porous object (1) which comprises diamond particles (2) that have been sintered in the state of being in direct contact with one another and an infiltration aid layer (4) selectively formed only on the exposed surface of the individual diamond particles. Also disclosed is a process for producing the member, the process including a step in which a mixture of diamond particles, a powder of an element as a source of the infiltration aid layer, and a powder of ammonium chloride is compression-molded and then heated to 900ºC or higher to form the porous object. Furthermore disclosed is a semiconductor device which comprises the member for semiconductor element mounting and a semiconductor element mounted on the element mounting surface thereof through a bonding layer.