PURPOSE: A semiconductor device having a coated solder ball is provided to maximize fine pitch between solder balls by arranging the solder balls as the state in which the solder balls contact each other and to improve the reliability of a package and the adhesive strength of a solder adhesive part by multiplying the connecting area of the solder balls. CONSTITUTION: A solder ball(30) which is an electrical input-output means between a conductive pad(22) of a motherboard(20) and a borland(14) formed on a substrate(12) of a semiconductor package is welded. An insulating material(32) capable of locally eliminating by a polar solvent material is coated on the surface of the solder ball. An adhesive material for welding the solder ball and the polar solvent material are spread on the conductive pad of the motherboard in which the semiconductor package is mounted and the borland of the substrate.
