| 摘要 |
<P>PROBLEM TO BE SOLVED: To enhance adhesion between a substrate and a sealing member in a resin-sealed module to solve the problem that when the substrate is covered together with a circuit component by the sealing member, a stress caused by a difference in thermal expansion coefficient between the substrate and the sealing member makes insufficinet the adhesion of a junction between the substrate and the sealing member, resulting in sealing member separation from the substrate. <P>SOLUTION: A sealing surface of a substrate made of two or more materials having different melting points is locally heated at a temperature higher than the melting point of at least one of the two or more materials to form a hole or slot which is filled with a sealing member. This heat treatment is carried out originally for inter-layer connection of a multilayer substrate. In this treatment, removing a plating layer for the inter-layer connection exposes irregularities that are formed on the inner wall of a blind-via because of the difference in melting point between the plurality of materials making up the substrate. These irregularities engage with the sealing member filling the hole or slot to strengthen the adhesion. <P>COPYRIGHT: (C)2011,JPO&INPIT |
