| 摘要 |
<P>PROBLEM TO BE SOLVED: To facilitate connection inspection between upper and lower semiconductor packages, and ensure high reliability. <P>SOLUTION: A semiconductor module has a second semiconductor package 200 mounted on a first semiconductor package 100. In the module, the first semiconductor package 100 includes: pads 15 formed on the top surface of the package 100; external connection terminals 2 formed on the underside of the package 100; and vias 18 electrically connecting the pads 15 and the connection terminals 2. In a radiographic plane viewed in a vertical direction relative to one surface of a second substrate 25 of the second semiconductor package 200, the via 18 overlaps the pad 15 or the connection terminal 2, the pad 15 and the connection terminal 2 overlap each other, and the pad 15 has the center position outside the connection terminal 2. <P>COPYRIGHT: (C)2011,JPO&INPIT |
