COMPOSITE COPPER FINE POWDER

摘要

PROBLEM TO BE SOLVED: To provide a copper based fine powder in which a thermal shrinkage problem at low temperature upon firing is remedied, and which is therefore suitable as an electrode material for electronic components such as a monolithic ceramic capacitor. SOLUTION: The composite copper fine powder is made of copper and 1 to 20 wt.% of high melting point metal and has an average particle diameter of 10 to 100 nm, wherein at least one kind of high melting point metal selected from among tungsten, molybdenum and tantalum is present on the surface of each copper fine particle. The high melting point metal is present in a granular state or a film state on the surface of each copper fine particle, and thermal shrinkage starting temperature of the composite copper fine powder is 400 to 900°C. The composite copper fine powder can be produced by vaporizing copper or a copper compound and a high melting point metallic compound by thermal plasma and condensing the obtained metal vapor. COPYRIGHT: (C)2011,JPO&INPIT