| 摘要 |
PROBLEM TO BE SOLVED: To provide a shape measuring apparatus and a shape measuring method suited for measuring an edge profile of a thin sample such as a semiconductor wafer or the like. SOLUTION: A distribution of surface angle and an edge profile of a measurement site P is calculated by irradiating the measurement site P of a wafer 1 with light at sequentially different angles of irradiation by sequentially switching and blinking a plurality of LEDs 12 each disposed at one of plurality of positions in one plane by an LED driving circuit 11, the measurement site P being an end face of the wafer 1 and a mirror finished or shiny surface, obtaining image data showing a luminance distribution of the reflected light form the measurement site P through a camera 20 by a calculator 30 on each irradiation with light, and estimating an angle of irradiation with the light when the luminance of the reflected light reaches a peak on the basis of image data and angle of irradiation with the light corresponding to each LED 12 by the calculator 30. COPYRIGHT: (C)2011,JPO&INPIT
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