| 摘要 |
PROBLEM TO BE SOLVED: To provide a game machine mounted with a circuit board which is improved in heat emission efficiency of a heat emitting member to be mounted. SOLUTION: A heat emission pad is formed as follows: a pad corresponding to an electricity output side of a first component formed between, for example, a pad corresponding to the electricity output side pin of the first component and a pad corresponding to an electricity input side pin of the first component is formed from the pad corresponding to the output side pin of the first component toward the pad corresponding to the electricity input side pin of the first component, and then its direction is changed at almost 90 degrees, and the heat emission pad is formed extending from the area directly under the first component to the area except the arrangement area of the first component. COPYRIGHT: (C)2011,JPO&INPIT
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