SEMICONDUCTOR DEVICE WITH A VARIABLE INTEGRATED CIRCUIT CHIP BUMP PITCH

摘要

A semiconductor device is described that comprises an integrated circuit substrate comprising a plurality of bonding pads for enabling electrical connectivity to a chip circuit. The bonding pads are at least partially covered by a passivation layer having pre-manufactured holes. The device also includes a chip having a plurality of bumps atop the bonding pads, wherein areas of the bumps are larger than respective areas of cooperating holes in the passivation layer.