发明名称 |
Surface Preparation of Die for Improved Bonding Strength |
摘要 |
A surface preparation method for improved adhesion in an electronic package system. The method of improving adhesion in the electronic package system includes depositing a passivation layer on a bonding surface and roughening at least a portion of the passivation layer. A coating material is deposited on the passivation layer. The bonding surface can be part of a semiconductor or package substrate. The roughening process can be performed by a chemical or mechanical process. In another embodiment, an electronic package system includes a bonding surface of a semiconductor or package substrate. A passivation layer is deposited on the bonding surface and a portion of the passivation layer is roughened for improved adhesion. A coating material is deposited on the roughened portion of the passivation layer.
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申请公布号 |
US2011193211(A1) |
申请公布日期 |
2011.08.11 |
申请号 |
US20100701201 |
申请日期 |
2010.02.05 |
申请人 |
QUALCOMM INCORPORATED |
发明人 |
CHANDRASEKARAN ARVIND;GU SHIQUN;RAY URMI |
分类号 |
H01L23/538;H01L21/56;H01L21/60 |
主分类号 |
H01L23/538 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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