| 发明名称 |
3DIC Architecture with Die Inside Interposer |
| 摘要 |
A device is formed to include an interposer having a top surface, and a bump on the top surface of the interposer. An opening extends from the top surface into the interposer. A first die is bonded to the bump. A second die is located in the opening of the interposer and bonded to the first die.
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| 申请公布号 |
US2011193235(A1) |
申请公布日期 |
2011.08.11 |
| 申请号 |
US20100775186 |
申请日期 |
2010.05.06 |
| 申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
HU HSIEN-PIN;YU CHEN-HUA;LAI JIUN REN;CHEN MING-FA |
| 分类号 |
H01L23/538 |
主分类号 |
H01L23/538 |
| 代理机构 |
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代理人 |
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