METHOD FOR MANUFACTURING A SOLDER RESIST DAM

摘要

PURPOSE: A solder resist dam manufacturing method of a package substrate is provided to prevent assembly fault and to improve workability and small outline package processing yield by supplementing limited position matching capability and non-uniformity of a screen printing method of construction. CONSTITUTION: A first solder resist is spread on the substrate surface using a roll coater. A first exposure is enforced using a mask and the first solder resist is selectively hardened. A second solder resist is spread on the first solder resist using a roll coater and is flattened by a vacuum laminator. A mask for defining the site forming a dam is arranged and a second exposure is enforced and the second solder resist is selectively hardened. The first and the second solder resist are developed and the solder resist of the site which does not harden is eliminated.