METHOD FOR INSPECTING SUBSTRATE

摘要

PURPOSE: A method for inspecting a substrate is provided to improve the manufacturing reliability of a semiconductor package by applying a process of mounting a semiconductor chip. CONSTITUTION: In a method for inspecting a substrate, a substrate(150) having an object generates a 3D through a substrate inspection apparatus. The upper part of the target is extracted by differentiating the 3D map. The diameter and height of the upper area are calculated.