| 摘要 |
The arrangement (1) has a power semiconductor component (6) arranged on main sides of a fluid cooling device (2), where main sides lie opposite to each other. A fluid cooling device (2) has two mold bodies (10, 30) with a retainer for the semiconductor component. An inlet connector (100) of a distribution chamber (200) is arranged in one of mold bodies (10). Cooling chambers are attached to the power semiconductor component, and outlet areas (330) are arranged lateral to the cooling chambers. A common collection chamber (210) is provided with an outlet connector (300). |
