| 发明名称 |
HIGH THERMAL CONDUCTIVITY THERMOPLASTIC RESIN COMPOSITION AND THERMOPLASTIC RESIN |
| 摘要 |
<p>A thermoplastic resin composition according to the present invention contains an inorganic filler and a thermoplastic resin whose main chain contains a repeating unit represented by the general formula (1):
€ƒ€ƒ€ƒ€ƒ€ƒ€ƒ€ƒ€ƒ-M-Sp-€ƒ€ƒ€ƒ€ƒ€ƒ(1)
wherein M represents a mesogenic group; and Sp represents a spacer.</p> |
| 申请公布号 |
KR20110090974(A) |
申请公布日期 |
2011.08.10 |
| 申请号 |
KR20117012228 |
申请日期 |
2009.10.28 |
| 申请人 |
KANEKA CORPORATION |
发明人 |
YOSHIHARA SHUSUKE;MATSUMOTO KAZUAKI |
| 分类号 |
C08L67/00;C08G63/02;C08K3/00;C08L101/00 |
主分类号 |
C08L67/00 |
| 代理机构 |
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