发明名称 A STORING PACKAGE UNIT AND A STORING METHOD FOR MICRO MINUTE SOLDER SPHERES
摘要 An object of the present invention is to prevent "deteriorations," such as oxidization and deformation of micro solder spheres during storage. The micro solder spheres are packed in a container 2 comprising an air permeable material. A deoxidizing and drying agent 3 to be disposed externally to the container 2 is provided. The container 2 and the deoxidizing and drying agent 3 are placed in a bag member 4 impermeable to air, and the bag member 4 is sealed in an air-tight condition. Before sealing, the bag member 4 may be air evacuated. A plurality of containers 2 may be held by a holding member 5 such that they are fixed in positions relative to each other.
申请公布号 EP2354035(A1) 申请公布日期 2011.08.10
申请号 EP20090830156 申请日期 2009.11.26
申请人 SENJU METAL INDUSTRY CO., LTD 发明人 SATO, ISAMU;SOUMA, DAISUKE;FUJIKURA, KAZUO
分类号 B65D77/04;B65D77/26;B65D81/03;B65D81/20;B65D81/26;B65D85/50 主分类号 B65D77/04
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