SEMICONDUCTOR CHIP AND SEMICONDUCTOR MODULE HAVING THE SAME

摘要

PURPOSE: A semiconductor chip and a semiconductor module including the same are provided to minimize the physical distance between components by implementing a termination resistor as a re-interconnection pattern. CONSTITUTION: In a semiconductor chip and a semiconductor module including the same, at least one center pad(120) is arranged in a center area. A first center pad is connected to memory cells. At least one first edge pad(140) is arranged in an edge region. A first edge pad is connected to a first transmission line. At least one second edge pad(150) is arranged in an edge region. A second edge pad is connected to a chip set voltage supply unit(180). At least one first rewiring pattern(R1) is connected between a first center pad and a first edge pad At least one second rewiring pattern(R2) is connected between a first center pad and a first edge pad.