SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THEREOF
摘要
<p>PURPOSE: A semiconductor package and a fabricating method thereof are provided to simplify a package manufacturing process without an additional process such as a solder ball milling process and a drilling process. CONSTITUTION: A semiconductor package and a fabricating method thereof comprises: a unit substrate(100) having a top side and bottom side; a semiconductor chip(120) which is formed on the top side of the unit substrate and electrically being connected to the unit substrate; a connection terminal which is arranged on the edge of the unit substrate; and a sealing member(150) which is formed on the semiconductor chip to expose the top side of the connection terminal.</p>
