| 摘要 |
<p>Disclosed are a light emitting device, a method of manufacturing the same, a light emitting device package, and a lighting system. The light emitting device includes the light emitting structure layer including a first conductive semiconductor layer (110), a second conductive semiconductor layer (130), and an active layer (120) between the first and second conductive semiconductor layers, a conductive support substrate (205) electrically connected to the second conductive semiconductor layer, a contact (502) electrically connected to the first conductive semiconductor layer, a dielectric material (503) making contact with the contact and interposed between the contact and the conductive support substrate, and an insulating layer (501,504) electrically insulating the contact from the active layer, the second conductive semiconductor layer, and the conductive support substrate.</p> |
