发明名称 METHOD FOR PROCESSING A COPPER BEAM FOR PRINTED CIRCUIT BOARD
摘要 PURPOSE: A method for processing a copper beam for a printed circuit board is provide to prevent damage to the printed circuit board which in inserted into a roller by providing a reinforcing frame to the printed circuit board. CONSTITUTION: A method for processing a copper beam for a printed circuit board is comprised of the following steps: forming a dummy copper film(20') along the edge of a substrate core; masking to expose only the dummy copper film formed along the edge of the substrate to the outside; plating copper on the exposed dummy film to form a copper beam(45); and spreading solder resist(100) after exfoliating the mask.
申请公布号 KR20110090162(A) 申请公布日期 2011.08.10
申请号 KR20100009789 申请日期 2010.02.03
申请人 APERIO CO., LTD. 发明人 YOO, JUNG WOO;KIM, HO SIK;YOON, HYUNG KYU
分类号 H05K3/18;H05K3/24 主分类号 H05K3/18
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