发明名称 |
METHOD FOR PROCESSING A COPPER BEAM FOR PRINTED CIRCUIT BOARD |
摘要 |
PURPOSE: A method for processing a copper beam for a printed circuit board is provide to prevent damage to the printed circuit board which in inserted into a roller by providing a reinforcing frame to the printed circuit board. CONSTITUTION: A method for processing a copper beam for a printed circuit board is comprised of the following steps: forming a dummy copper film(20') along the edge of a substrate core; masking to expose only the dummy copper film formed along the edge of the substrate to the outside; plating copper on the exposed dummy film to form a copper beam(45); and spreading solder resist(100) after exfoliating the mask.
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申请公布号 |
KR20110090162(A) |
申请公布日期 |
2011.08.10 |
申请号 |
KR20100009789 |
申请日期 |
2010.02.03 |
申请人 |
APERIO CO., LTD. |
发明人 |
YOO, JUNG WOO;KIM, HO SIK;YOON, HYUNG KYU |
分类号 |
H05K3/18;H05K3/24 |
主分类号 |
H05K3/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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