发明名称 Semiconductor device and semiconductor device manufacturing method
摘要 A semiconductor device includes a plurality of first MOS transistors has a first gate electrode formed on a first gate insulating film provided on a semiconductor substrate, a plurality of second MOS transistors has a second gate electrode formed on a second gate insulating film which is provided on the substrate and which is smaller in thickness than the first gate insulating film. A first element isolation region has a first region and a second region, a bottom surface of the second region is deeper than that of the first region by the difference of thickness between the first gate insulating film and the second gate insulating film, and a bottom surface of the first region is equal in a bottom surface of a second element isolation region.
申请公布号 US7994587(B2) 申请公布日期 2011.08.09
申请号 US20090484526 申请日期 2009.06.15
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 ENDO MASATO;UCHIDA KANAE
分类号 H01L29/78 主分类号 H01L29/78
代理机构 代理人
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