发明名称 White-light light emitting diode chips and fabrication methods thereof
摘要 A white-light LED chip and a fabrication method thereof are provided. The white-light LED chip comprises a blue-light LED chip and a phosphor layer directly disposed on a top surface of the blue-light LED chip. The method comprises providing a plurality of blue-light LED chips attached to a substrate, wherein at least one contact pad is formed on the top surface of each blue-light LED chip. A protective layer is formed on the contact pad. A phosphor layer is formed on the top surface of the blue-light LED chip by a molding process, exposing the contact pad. Finally, the protective layer and the substrate are removed from the blue-light LED chip to form a white-light LED chip.
申请公布号 US7994531(B2) 申请公布日期 2011.08.09
申请号 US20090417412 申请日期 2009.04.02
申请人 VISERA TECHNOLOGIES COMPANY LIMITED 发明人 LIN CHUN-CHI;LIN TZU-HAN;KANG WEI-HUNG
分类号 H01L33/00 主分类号 H01L33/00
代理机构 代理人
主权项
地址