发明名称 |
WAFER TRANSFER WITH DETECTING WAFER WARPAGE AND CONTROL METHOD THEREOF |
摘要 |
<p>PURPOSE: A wafer transfer device including a wafer bending detecting means and a controlling method thereof are provided to use a wafer bending detecting means like a micro camera before picking up the wafer by tweezers in a shipping box, thereby preventing picking up bent wafers by the tweezers. CONSTITUTION: A wafer bending detecting means detects a wafer(100) bending. A control part(420) controls tweezers operation in order to not transfer a bent wafer to process equipment(900) by operating image data acquired from the wafer bending detecting means. A wafer transfer device includes the wafer bending detecting means and the control part. The wafer bending detecting means is a micro camera(500) installed in the end of tweezers(200) in order to achieve an image by scanning the wafer aligned up and down in a shipping box(10).</p> |
申请公布号 |
KR20110089645(A) |
申请公布日期 |
2011.08.09 |
申请号 |
KR20100009138 |
申请日期 |
2010.02.01 |
申请人 |
SEYANG ELECTRONICS CO., LTD. |
发明人 |
CHO, SUNG YEOL |
分类号 |
H01L21/677;B25J9/16;B65G49/07;G06K9/36 |
主分类号 |
H01L21/677 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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