发明名称 WAFER TRANSFER WITH DETECTING WAFER WARPAGE AND CONTROL METHOD THEREOF
摘要 <p>PURPOSE: A wafer transfer device including a wafer bending detecting means and a controlling method thereof are provided to use a wafer bending detecting means like a micro camera before picking up the wafer by tweezers in a shipping box, thereby preventing picking up bent wafers by the tweezers. CONSTITUTION: A wafer bending detecting means detects a wafer(100) bending. A control part(420) controls tweezers operation in order to not transfer a bent wafer to process equipment(900) by operating image data acquired from the wafer bending detecting means. A wafer transfer device includes the wafer bending detecting means and the control part. The wafer bending detecting means is a micro camera(500) installed in the end of tweezers(200) in order to achieve an image by scanning the wafer aligned up and down in a shipping box(10).</p>
申请公布号 KR20110089645(A) 申请公布日期 2011.08.09
申请号 KR20100009138 申请日期 2010.02.01
申请人 SEYANG ELECTRONICS CO., LTD. 发明人 CHO, SUNG YEOL
分类号 H01L21/677;B25J9/16;B65G49/07;G06K9/36 主分类号 H01L21/677
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