发明名称 Light emitting device and method for manufacturing the same
摘要 A light-emitting chip includes a base, a transparent material layer and a light-emitting chip. The base has an upper surface including a conductive pattern. The transparent material layer is disposed on the upper surface of the base and has an opening part which is located on region at least part of the conductive pattern. The light-emitting chip is mounted on the conductive pattern and located in the opening part of the transparent material layer.
申请公布号 US7994528(B2) 申请公布日期 2011.08.09
申请号 US20080056893 申请日期 2008.03.27
申请人 KYOCERA CORPORATION 发明人 MATSUURA SHINGO;YANAGISAWA MITSUO;SAKUMOTO DAISUKE
分类号 H01L33/00;H01L33/50;H01L33/60;H01L33/62 主分类号 H01L33/00
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