发明名称 |
Light emitting device and method for manufacturing the same |
摘要 |
A light-emitting chip includes a base, a transparent material layer and a light-emitting chip. The base has an upper surface including a conductive pattern. The transparent material layer is disposed on the upper surface of the base and has an opening part which is located on region at least part of the conductive pattern. The light-emitting chip is mounted on the conductive pattern and located in the opening part of the transparent material layer.
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申请公布号 |
US7994528(B2) |
申请公布日期 |
2011.08.09 |
申请号 |
US20080056893 |
申请日期 |
2008.03.27 |
申请人 |
KYOCERA CORPORATION |
发明人 |
MATSUURA SHINGO;YANAGISAWA MITSUO;SAKUMOTO DAISUKE |
分类号 |
H01L33/00;H01L33/50;H01L33/60;H01L33/62 |
主分类号 |
H01L33/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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