发明名称 Moving carrier for lead frame and method of moving lead frame using the moving carrier
摘要 Provided are a moving carrier for a lead frame, and a method of moving a lead frame using the moving carrier. The moving carrier includes a base which supports the lead frame including a body and a chip attach pad on which a chip is disposed. The moving carrier includes a groove portion which is integrated with a part of the base and contains the chip attach pad of the lead frame. The lead frame is inserted or withdrawn into or out from a magazine using the moving carrier and thus without deformation of the lead frame or damage to the chip.
申请公布号 US7993092(B2) 申请公布日期 2011.08.09
申请号 US20080190426 申请日期 2008.08.12
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 LIU YIBO;CHEN QIANG
分类号 B65G1/133 主分类号 B65G1/133
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