发明名称 |
Moving carrier for lead frame and method of moving lead frame using the moving carrier |
摘要 |
Provided are a moving carrier for a lead frame, and a method of moving a lead frame using the moving carrier. The moving carrier includes a base which supports the lead frame including a body and a chip attach pad on which a chip is disposed. The moving carrier includes a groove portion which is integrated with a part of the base and contains the chip attach pad of the lead frame. The lead frame is inserted or withdrawn into or out from a magazine using the moving carrier and thus without deformation of the lead frame or damage to the chip.
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申请公布号 |
US7993092(B2) |
申请公布日期 |
2011.08.09 |
申请号 |
US20080190426 |
申请日期 |
2008.08.12 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
LIU YIBO;CHEN QIANG |
分类号 |
B65G1/133 |
主分类号 |
B65G1/133 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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