发明名称 |
Electronic assembly for image sensor device |
摘要 |
An electronic assembly for an image sensor device is disclosed. The electronic assembly comprises a package module and a lens set mounted thereon. The package module comprises a device substrate comprising at least one grounding plug therein, in which the grounding plug is insulated from the device substrate and an array of optoelectronic devices therein. A transparent substrate comprises a dam portion attached to the device substrate to form a cavity between the device and transparent substrates. A micro-lens array is disposed within the cavity. A conductive layer is electrically connected to the grounding plug and covers the sidewalls of the lens set and the package module and the upper surface of the lens set. A method for fabricating the electronic assembly is also disclosed.
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申请公布号 |
US7994598(B2) |
申请公布日期 |
2011.08.09 |
申请号 |
US20100897176 |
申请日期 |
2010.10.04 |
申请人 |
VISERA TECHNOLOGIES COMPANY LIMITED |
发明人 |
WENG JUI-PING;LIN TZU-HAN |
分类号 |
H01L31/0232 |
主分类号 |
H01L31/0232 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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