发明名称 Integrated circuit contact system
摘要 An integrated circuit contact system is provided including forming a contact plug in a dielectric and forming a first barrier layer in a trench in the dielectric and on the contact plug. Further, the system includes removing a portion of the first barrier layer from the bottom of the first barrier layer and depositing the portion of the first barrier layer on the sidewall of the first barrier layer, and forming a second barrier layer over the first barrier layer and filling a corner area of the trench.
申请公布号 US7994047(B1) 申请公布日期 2011.08.09
申请号 US20050286173 申请日期 2005.11.22
申请人 SPANSION LLC;ADVANCED MICRO DEVICES, INC. 发明人 WOO CHRISTY MEI-CHU;CHENG NING;YAO HUADE WALTER
分类号 H01L23/485 主分类号 H01L23/485
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