发明名称 |
Curable silicone composition and electronic component |
摘要 |
A curable silicone composition comprising at least the following components: (A) an epoxy-containing organopolysiloxane; (B) a curing agent for epoxy resin; and (C) an epoxy compound represented by the specific general formula; is characterized by excellent handleability and reduced oil-bleeding, and, when cured, forms a cured body of excellent flexibility and adhesion. |
申请公布号 |
US7994246(B2) |
申请公布日期 |
2011.08.09 |
申请号 |
US20070520899 |
申请日期 |
2007.12.14 |
申请人 |
DOW CORNING TORAY COMPANY, LTD. |
发明人 |
MORITA YOSHITSUGU;KATO TOMOKO |
分类号 |
C08K5/1515;C08K5/16 |
主分类号 |
C08K5/1515 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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