WAFER HEATING APPARATUS, ELECTROSTATIC CHUCK, AND METHOD FOR MANUFACTURING WAFER HEATING APPARATUS

摘要

A wafer heating apparatus includes a base member having an upper surface which is flat; an insulating layer having a heater electrode embedded therein; a uniformly heating plate bonded to an upper surface of the insulating layer with an upper surface thereof being closer to a wafer; and a bonding layer made of a filler-containing resin, configured to bond a lower surface of the insulating layer to the upper surface of the base member. The bonding layer includes at least two layers of a first bonding layer on a base member side and a second bonding layer contacted with the insulating layer. The second bonding layer contains fillers with a flat-shape. The fillers are arranged to lie flat along a planar direction of the second bonding layer.