发明名称 |
Semiconductor substrate, laminated chip package, semiconductor plate and method of manufacturing the same |
摘要 |
A semiconductor substrate has a plurality of groove portions formed along scribe lines. The semiconductor substrate includes: a unit region in contact with at least any one of the plurality of groove portions; and a wiring electrode with a portion thereof arranged within the unit region. Further, the plurality of groove portions have a wide-port structure in which a wide width portion wider in width than a groove lower portion including a bottom portion is formed at an inlet port thereof.
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申请公布号 |
US2011186985(A1) |
申请公布日期 |
2011.08.04 |
申请号 |
US20100656458 |
申请日期 |
2010.01.29 |
申请人 |
HEADWAY TECHNOLOGIES, INC.;SAE MAGNETICS (H.K.) LTD. |
发明人 |
SASAKI YOSHITAKA;ITO HIROYUKI;IIJIMA ATSUSHI |
分类号 |
H01L23/498;H01L21/50;H01L21/768;H01L23/28 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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