发明名称 RESIN, PHOTORESIST COMPOSITION AND METHOD FOR PRODUCING RESIST PATTERN
摘要 <P>PROBLEM TO BE SOLVED: To provide a resin for a photoresist composition capable of forming a pattern having satisfactory resolution and exposure margin. <P>SOLUTION: A photoresist composition containing the resin is provided wherein the resin comprises a structural unit derived from a compound represented by formula (I) and a structural unit derived from a compound represented by formula (II), wherein R<SP>1</SP>and R<SP>31</SP>represent a hydrogen atom, a halogen atom or an alkyl group that optionally has a halogen atom; X<SP>1</SP>represents a heterocyclic group; Z<SP>1</SP>represents a divalent saturated hydrocarbon group; R<SP>32</SP>and R<SP>33</SP>represent a hydrogen atom, a methyl group or a hydroxy group, provided that at least one of R<SP>32</SP>and R<SP>33</SP>is a hydroxy group; and R<SP>34</SP>and R<SP>35</SP>represent a 1-6C alkyl group. <P>COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011148982(A) 申请公布日期 2011.08.04
申请号 JP20100271624 申请日期 2010.12.06
申请人 SUMITOMO CHEMICAL CO LTD 发明人 ICHIKAWA KOJI;MUKAI YUICHI
分类号 C08F220/58;C08F220/28;G03F7/004;G03F7/039;H01L21/027 主分类号 C08F220/58
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