发明名称 PERFORATED INSULATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
摘要 <p><P>PROBLEM TO BE SOLVED: To propose a perforated insulating substrate which can be accurately manufactured, in a relatively simple and inexpensive manner, and to provide a method of manufacturing the substrate. <P>SOLUTION: During an assembly process A, a plurality of metal wires 11 cut in a predetermined length are vertically kept on a glass plate, and a glass 13 as an insulating material cut into a predetermined shape is provided in contact with a base tool 14 of a predetermined shape. During a heating process B, an assembled body is passed through a heating furnace, and the metal wires 11 are pressurized and buried into the softened glass 13. The pressing method includes a step of bringing a weight tool 15 in contact with the plurality of metal wires 11 kept vertical, and pressing against them by gravity. The united plate having the metal wires 11 planted on the glass 13 is disassembled into respective tools during a disassembly process C after slow cooling, to have the united plate 17 separated. The united glass plate 17 is immersed in a metal dissolving liquid 18 of aqua regia comprising nitric acid and hydrochloric acid during a metal dissolving process F, so as to dissolve and remove the metal wires 11. Both surfaces of the glass are polished and ground during a polishing process G to complete the perforated insulating substrate 20, having a plurality of through holes formed on a glass plate. <P>COPYRIGHT: (C)2011,JPO&INPIT</p>
申请公布号 JP2011151415(A) 申请公布日期 2011.08.04
申请号 JP20110091785 申请日期 2011.04.18
申请人 NEC SCHOTT COMPONENTS CORP;SANTEKKU:KK 发明人 KAMATA HIROSHI;ANZAI MASAMI
分类号 H01L23/15;H01L23/13;H05K3/00 主分类号 H01L23/15
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