发明名称 |
THREE DIMENSIONAL MULTILAYER CIRCUIT |
摘要 |
<p>A three dimensional multilayer circuit (600) includes a plurality of crossbar arrays (512) made up of intersecting crossbar segments (410, 420) and programmable crosspoint devices (514) interposed between the intersecting crossbar segments (410, 420). Shift pins (505, 510) are used to shift connection domains (430) of the intersecting crossbar segments (410, 420) between stacked crossbar arrays (512) such that the programmable crosspoint devices (514) are uniquely addressed. The shift pins (505, 510) make electrical connections between crossbar arrays (512) by passing vertically between crossbar segments (410, 510) in the first crossbar array (512) and crossbar segments in a second crossbar array. A method for transforming multilayer circuits is also described.</p> |
申请公布号 |
WO2011093863(A1) |
申请公布日期 |
2011.08.04 |
申请号 |
WO2010US22489 |
申请日期 |
2010.01.29 |
申请人 |
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.;WU, WEI;WILLIAMS, STANLEY, R. |
发明人 |
WU, WEI;WILLIAMS, STANLEY, R. |
分类号 |
H01L29/76;H01L29/40 |
主分类号 |
H01L29/76 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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