| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that a projecting part breaks and occludes in a discharge port or others and the reliability of the liquid discharge head is deteriorated, when mounting or assembling the liquid discharge head, in the case of presence of the projecting part, because a layer of silicon oxide projects and remains at the end part of a supplying port, when using the layer of the silicon oxide as an etching mask for making the supplying port, when manufacturing a liquid discharge head. SOLUTION: A concave part 10a is formed by using etching liquid which has a large etching selectivity ratio of the silicon oxide layer and silicon and hardly etches the silicon oxide layer on a silicon substrate 1 having a mask 13 of the silicon oxide layer. Then, the silicon oxide layer 13 is eliminated by using etching liquid having smaller etching selectivity ratio of the silicon oxide and the silicon and the supplying port 10 is formed by piercing the concave part 10a. COPYRIGHT: (C)2011,JPO&INPIT
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