发明名称 |
MOUNTING SUBSTRATE FOR LIGHT EMITTING ELEMENT, METHOD OF MANUFACTURING MOUNTING SUBSTRATE FOR LIGHT EMITTING ELEMENT, LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING LIGHT EMITTING DEVICE |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a mounting substrate for a light emitting element which can improve both heat radiating property and insulating property, a method of manufacturing the mounting substrate for a light emitting element, a light emitting device and a method of manufacturing the light emitting device. <P>SOLUTION: An aluminum oxide layer 14 is formed in at least one surface of an aluminum substrate 12 by an anode oxidation method, a solution wherein perhydropolysilazane is dissolved is applied on the aluminum oxide layer 14 and a silica glass layer 16 is formed by heating treatment. A conductor pattern is formed on the silica glass layer 16 by a copper plating pattern layer 18 and a silver plating layer 20, an LED chip 24 is fixed to a part of the silver plating layer 20 by an adhesive layer 26 and a conductor pattern and the LED chip 24 are electrically connected via a wire 22. <P>COPYRIGHT: (C)2011,JPO&INPIT |
申请公布号 |
JP2011151395(A) |
申请公布日期 |
2011.08.04 |
申请号 |
JP20100287720 |
申请日期 |
2010.12.24 |
申请人 |
SHOWA DENKO KK |
发明人 |
FUJITA TOSHIO;UCHIDA HIROSHI;TADA KIYOSHI;MIZO TATSUHIRO |
分类号 |
H01L33/64;H01L23/12;H01L23/15 |
主分类号 |
H01L33/64 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|