发明名称 POWER MODULE
摘要 PURPOSE: A power module is provided to supply the power module with a superior heat radiation property. CONSTITUTION: A conductive circuit is formed on an insulating layer(5) in a substrate(2) for a power module(1). A power device(3) is installed on the substrate for the power module and electrically connected to the conductive circuit. A thermally conductive sheet radiates heat generated from the power device and/or the substrate for the power module. The thermally conductive sheet includes a plate shaped boron nitride particle. The thermal conductivity in the orthogonal direction with respect to the thickness direction of the thermally conductive sheet is more than or equals to 4 W/m·K.
申请公布号 KR20110089102(A) 申请公布日期 2011.08.04
申请号 KR20110009621 申请日期 2011.01.31
申请人 NITTO DENKO CORPORATION 发明人 IZUTANI SEIJI;UCHIYAMA HISAE;FUKUOKA TAKAHIRO;HARA KAZUTAKA
分类号 H01L23/373;H05K7/20 主分类号 H01L23/373
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