发明名称 WAFER CARRYING DEVICE AND WAFER CARRYING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a wafer carrying method and a wafer carrying device capable of performing work of supplying and separating a plurality of wafers more efficiently. SOLUTION: The wafer carrying device A includes a supporting means 2 supporting a wafer group Wf, a sending-out means 4 for sending out at least the uppermost-positioned wafer Wf1 of the wafer group Wf supported by the supporting means 2, and a holding means 3 having a holding member 33 which can hold the wafer group Wf and capable of switching the state between a first state that the distance between the holding member 33 and the supporting means 2 is relatively increased and a second state that the distance between the holding member 33 and the supporting means 2 is relatively decreased. When the holding means 3 is in the first state, the wafer group Wf can be supplied to the holding member 33 and when the holding means 3 is in the second state, the wafer group Wf can be moved from the holding member 33 to the supporting means 2. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011151167(A) 申请公布日期 2011.08.04
申请号 JP20100010665 申请日期 2010.01.21
申请人 SUMITOMO METAL FINE TECHNOLOGY CO LTD 发明人 SHIRAI KAZUO;MIYAI HIROTAKA;NISHIOKA TAMOTSU
分类号 H01L21/677;B65G49/07 主分类号 H01L21/677
代理机构 代理人
主权项
地址