| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor integrated circuit free from increase in chip area or significant reversion in designing. SOLUTION: The semiconductor integrated circuit includes: IO buffers 1 to 5 arrayed in line; pad coupling wirings 21 to 25 respectively arrayed in correspondence with the IO buffers 1 to 5; and IO buffer switching wirings 31 to 35 respectively arrayed in line in correspondence with the IO buffers 1 to 5, set in a layer different from those of the IO buffers 1 to 5 and the pad coupling wirings 21 to 25 so that they overlap with part of the corresponding pad coupling wirings, and extended to other pad coupling wirings adjacent to the corresponding pad coupling wirings. Each of the IO buffer switching wirings 31 to 35 is formed in an identical shape so that it is not short-circuited to adjacent other IO buffer switching wirings. The IO buffers 1 to 5 are electrically coupled with the corresponding IO buffer switching wirings in the same positions. COPYRIGHT: (C)2011,JPO&INPIT
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