发明名称 APPARATUS FOR CONTROLLING TEMPERATURE UNIFORMITY OF A SUBSTRATE
摘要 Apparatus for controlling thermal uniformity of a substrate is provided herein. In some embodiments, the thermal uniformity of the substrate may be controlled to be more uniform. In some embodiments, the thermal uniformity of the substrate may be controlled to be non-uniform in a desired pattern. In some embodiments, an apparatus for controlling thermal uniformity of a substrate may include a substrate support having a support surface to support a substrate thereon; and a plurality of flow paths having a substantially equivalent fluid conductance disposed within the substrate support to flow a heat transfer fluid beneath the support surface.
申请公布号 WO2011094142(A2) 申请公布日期 2011.08.04
申请号 WO2011US22201 申请日期 2011.01.24
申请人 APPLIED MATERIALS, INC.;BERA, KALLOL;ZHOU, XIAOPING;BUCHBERGER, JR., DOUGLAS A.;NGUYEN, ANDREW;TAVASSOLI, HAMID;KUMAR, SURAJIT;RAUF, SHAHID 发明人 BERA, KALLOL;ZHOU, XIAOPING;BUCHBERGER, JR., DOUGLAS A.;NGUYEN, ANDREW;TAVASSOLI, HAMID;KUMAR, SURAJIT;RAUF, SHAHID
分类号 H01L21/683;C23C16/40;H01L21/205;H01L21/68 主分类号 H01L21/683
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