| 摘要 |
<p>This exchanger comprises a housing divided into two chambers (10, 11) which are joined together by numerous parallel tubes (23) running from a lower heat-exchange face (5) to an upper face (6) to which a compressive force may be applied. The coolant fluid passes entirely past the faces (5 and 6), thus removing heat in a very uniform manner. The pressure drop is modest. The exchanger (1) is flexible enough to hug the surface of the elements (3) that are to be cooled while at the same time, thanks to the tubes, resisting the compressive forces required. Possible application to the cooling of a power semiconductor or any other component that requires cooling or heating.</p> |
