DIE BONDING METHOD USING THE DIE BONDER WITH TURNTABLE PICKER

摘要

PURPOSE: A die bonder equipped with a turn-table peaker is provided to efficiently process die-bonding by reducing waste of time created in the process where a pick-up arm returns using the turn-table peaker which consistently supplies a semiconductor chip while a turn-table rotates. CONSTITUTION: A transport part loads a LF(lead frame) on an index rail and transfers(S10). A dispensing part spreads adhesive on the lead frame transferred to the index rail(S20). A wafer(W) is settled in a wafer support(S30). A bonding part picks up a die(semiconductor chip,D) arranged on the wafer in one side and places the die on the lead frame in which adhesive is spread up in the other side(S40).