| 摘要 |
PROBLEM TO BE SOLVED: To provide a solder ball weighing instrument which weighs and supplies a solder ball without surface oxidation and damage of the solder ball, and also to provide a solder ball arrangement device which reduces surface oxidation and damage of the solder ball. SOLUTION: The solder ball weighing instrument comprises a storage part 1 wherein solder balls are stored, a weighing portion 2 for weighing the solder balls, and a gas supply device. The storage part stores therein a large quantity of solder balls in an inert gas atmosphere and includes a communicating portion to the weighing portion. In the weighing portion, a pressure gas is discharged from the gas supply device to a gas supply flow passage connected to a weighing cavity 10 wherein solder balls dropped from the storage part through an upper flow passage by gravity are temporarily stored, to blow off the solder balls temporarily stored in the weighing cavity, and the solder balls pass a lower flow passage 11 and are discharged from a weighing portion exit 13. The solder ball arrangement device intermittently supplies the solder balls fed by the weighing instrument, to a head and arranges the solder balls on a substrate electrode through openings provided in a mask. COPYRIGHT: (C)2011,JPO&INPIT |
