| 摘要 |
Disclosed is a substrate processing apparatus for forming a coating film on a substrate, which includes; a nozzle having a slit-shaped ejection port for ejecting a coating solution onto the substrate, the ejection port being elongated in a width direction of the substrate; a relative movement mechanism configured to cause relative movement between the nozzle and the substrate to allow the substrate to be relatively scanned by the nozzle; and a first gas flow generating unit configured to generate a gas flow of an inert gas that flows, uniformly along a direction of the relative movement, at least within a zone on one side of the nozzle above an area of the substrate having been scanned by the nozzle.
|
