发明名称 |
LED DEVICE, MANUFACTURING METHOD THEREOF, AND LIGHT-EMITTING DEVICE |
摘要 |
The LED device (27) has a LED bare chip (25) mounted directly on a metal contact (28), and supplies power to the bare chip and conducts heat from the bare chip via the metal contact. |
申请公布号 |
WO2011093174(A1) |
申请公布日期 |
2011.08.04 |
申请号 |
WO2011JP50756 |
申请日期 |
2011.01.18 |
申请人 |
JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED;KANNO, HIDEYUKI |
发明人 |
KANNO, HIDEYUKI |
分类号 |
H01L33/48 |
主分类号 |
H01L33/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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