| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a positive photosensitive resin composition which becomes a cured product excellent in heat resistance, mechanical properties, chemical resistance and adhesion to a substrate, can be cured in a low-temperature process, and exhibits excellent sensitivity and resolution. <P>SOLUTION: The positive photosensitive resin composition comprises (a) a polyimide, a polybenzoxazole or one of their precursors, each of which is soluble in an aqueous alkali solution, (b) a compound which generates an acid upon irradiation with light, (c) a compound having only one epoxy group within the molecule, and (d) a crosslinking agent having no epoxy group within the molecule. <P>COPYRIGHT: (C)2011,JPO&INPIT |
