| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for forming a tungsten-containing DLC coating on a base material of a contact probe pin for a semiconductor inspection device capable of adjusting easily a tungsten composition in the DLC coating, and having an excellent anti-tin-adhesion property for preventing adhesion of tin which is a main component of solder onto a contact part of the probe pin when the probe pin is brought into contact with the solder, and having excellent conductivity. SOLUTION: In this method for manufacturing a tungsten-containing diamond-like carbon coating on the base material of the contact probe pin for the semiconductor inspection device, the tungsten-containing diamond-like carbon coating is formed on the base material by performing sputtering in mixed gas of hydrocarbon gas and argon gas by using a tungsten carbide target. COPYRIGHT: (C)2011,JPO&INPIT
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