| 摘要 |
A heat dissipating system includes a circuit board, a chip module, a first clamping member, a second clamping member, and a plurality of stress adjusting members. The circuit board includes a top surface and a bottom surface opposite to the top surface. The chip module includes a base portion located on the top surface of the circuit board via solder balls and a chip disposed on the base portion. The first clamping member abuts the chip. The second clamping member abuts the bottom surface of the circuit board. The stress adjusting members extend through the second clamping member and engage with the first clamping member.
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