| 摘要 |
<p>Provided is an etching liquid for a multilayer thin film that has a copper layer and a titanium layer. Also provided is a method, using said etching liquid, for etching a multilayer thin film that has a copper layer and a titanium layer. The provided etching liquid, which has a pH between 1.5 and 2.5, contains (A) hydrogen peroxide, (B) nitric acid, (C) a fluorine ion source, (D) an azole, (E) quaternary ammonium hydroxide, and (F) a hydrogen peroxide stabilizer.</p> |
| 申请人 |
MITSUBISHI GAS CHEMICAL COMPANY, INC.;SHARP KABUSHIKI KAISHA;ADANIYA, TOMOYUKI;OKABE, SATOSHI;GOTOU, TOSHIYUKI;MARUYAMA, TAKETO;KOBAYASHI, KAZUKI;TANAKA, KEIICHI;NAKAMURA, WATARU;KITOH, KENICHI;TANAKA, TETSUNORI |
发明人 |
ADANIYA, TOMOYUKI;OKABE, SATOSHI;GOTOU, TOSHIYUKI;MARUYAMA, TAKETO;KOBAYASHI, KAZUKI;TANAKA, KEIICHI;NAKAMURA, WATARU;KITOH, KENICHI;TANAKA, TETSUNORI |
