| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method for increasing a bonding strength of a joint on a pair of semi-hollow molded bodies and a device. <P>SOLUTION: In secondary molding processing to be carried out after a pair of semi-hollow molded bodies 1 and 2 that constitutes a module housing (hollow molded body) of an air flow meter is primarily molded, the respective first and second outside partition walls 11 and 12 of a pair of semi-hollow molded bodies 1 and 2 are fused and fixed with a secondary molding resin (first and second sealing members 3 and 4), and an angle cylinder wall 18 of each center partition wall 13 is interposed with the secondary molding resin (flange of coupling member 5) from both sides, thereby bonding the joint on a pair of semi-hollow molded bodies 1 and 2. Thereby, since the bonding strength of the joint on a pair of semi-hollow molded bodies 1 and 2 is enhanced, it is not necessary to increase an injection pressure or a resin pressure when a molten resin is injected and filled in the secondary molding processing. Then, the secondary molding resin hardly leaks to the bypass channel side and air flowing through bypass channels 21 and 22 is not disordered, decreasing the measurement error of air flow. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
