| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of electrostatically chucking a substrate on a substrate holder reliably. SOLUTION: The chucking method of electrostatically chucking the substrate on the substrate holder includes an initial voltage step of applying an initial voltage to the substrate holder when mounting the substrate on the substrate holder, an chucking detection step of detecting whether the substrate is chucked to the substrate holder by measuring a leakage current while applying the initial voltage, and an chucking voltage step of applying an chucking voltage lower than the initial voltage to the substrate holder when it is detected that the substrate is chucked to the substrate holder in the chucking detection step. COPYRIGHT: (C)2011,JPO&INPIT |
