| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing an electronic circuit unit that suppresses a range of solder paste to be applied to a periphery of a through hole on a substrate during reflow soldering. SOLUTION: The method of manufacturing the electronic circuit unit includes: applying solder paste p1 to the through hole 55 and its periphery on a first mounting surface 52 of the substrate 50; melting the paste p1 by heating to make the paste flow in the through hole as solder (h); applying paste p2 to the through hole 55 and its periphery on a second mounting surface 52; arranging a connector 10 so that a tip of a connector terminal 12 is mounted on solder (h) solidified in the through hole 55; and in this state, melting the solidified solder (h) by heating to sink the tip of the connector terminal 12 mounted on the melted solidified solder (h), in the through hole 55, and making the paste p2 applied to the second mounting surface 52, flow in the through hole 55 as the solder (h). COPYRIGHT: (C)2011,JPO&INPIT
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